company news about Chengdu Eugenlight released a silicon optical integrated light source product

San Diego, CA, USA -- Chengdu Eugenlight, an optical device company specializing in optoelectronic integrated packaging and optoelectronic co-sealed CPO technology, announced the completion of its leading silicon optical integrated product platform. Announced and exhibited at OFC2023 its 1550nm FMCW Lidar light source based on silicon optical integration and its products for coherent tunable laser light source of 400G.

Silicon optical technology with its material characteristics and the inherent advantages of CMOS technology can greatly improve the integration of optoelectronic devices, reduce the cost and power consumption of high-speed optoelectronic products, and will have great potential in data center interconnection and high-speed long-distance applications. Optronics' silicon optical integrated product platform is a proprietary and highly integrated product platform developed for complex multi-chip integration applications such as silicon optical chips and semiconductor amplification Gain chip/SOA chips. The high optical coupling efficiency, high thermal management efficiency of the process platform, combined with the high automation process capability of the internal photoelectric design, ensure the high yield of leading products.

Among the two silicon optical integrated light source products released this time, the light source applied in the next generation of lidar with 4D frequency modulation continuous wave FMCW is based on the integrated MZM modulator and micro-ring structure silicon optical chip, and integrates the SOA chip of 1550nm wavelength with the external cavity active coupling mode, realizing the extremely narrow line width and high power output of the laser. Meet the packaging requirements of FMCW continuous frequency modulation Lidar light source. In addition, based on the design and technology of the platform, the tunable laser with 120 channel continuous tunable laser for coherent application of 400G was packaged using a silicon-based PIC filter with > 40G bandwidth.

Since its establishment, Chengdu Optronics focus on integrated packaging technology, especially in the multi-channel, multi-chip integration technology accumulation, has formed its own unique advantages. It is reported that in recent years, under the severe situation of declining market demand, light has maintained rapid growth against the market. The mature promotion of the silicon-optical integrated product platform will strongly promote the further expansion of Optronics in new fields.